With the MediaTek 8300 Dimensity, the company introduced its latest 8000-series Snapdragon chipset. This new System on Chip (SoC) serves as a direct successor to the upcoming 8200 Dimensity, focusing on overall efficiency enhancements and utilizing TSMC’s second-generation 4nm technology.
Mediatek’s 8300 Dimensity Overview
The 8300 Dimensity incorporates 4x Cortex-A715 performance cores clocked at speeds up to 3.35GHz and 2.2GHz efficiency cores. MediaTek asserts that all eight cores in the 8300 Dimensity are based on the Armv9 CPU architecture, delivering up to a 20% boost in CPU performance and a 30% increase in peak power efficiency compared to the competing 8200 Dimensity.
Comparison of Dimensity Chipsets:
| Chipset | Node | CPU Configuration | RAM | Storage | GPU | Display | Camera | 5G | Wi-Fi | Bluetooth |
|---|---|---|---|---|---|---|---|---|---|---|
| 8300 Dimensity | 4 nanometers | A715 at 3.35 GHz, 1x Cortex-A78 at 3.1GHz, 4x Cortex-A510 at 2.2GHz | LPDDR5X (up to 8 Mbps) | MCQ and UFS 4.0 | Mali-G615 (60% faster than 8200) | WQHD+@120Hz, FHD++@180Hz | 320 MP | 5.17 Mbps down | Wi-Fi 6E (2×2) | 5.4 |
| 8200 Dimensity | 4 nanometers | A715 at 3.0 GHz, 3x Cortex-A78 at 3.0 GHz, 4x Cortex-A55 at 2.0 GHz | LPDDR5 (up to 400 Mbps) | UFS 3.1 | MC6 Mali-G610 | WQHD+@120 Hz, FHD@168Hz | 320 MP | 4.7 GHz uplink | Wi-Fi 6E (2×2) | 5.3 |
| 8100 Dimensity | 5 nanometers | 4x Cortex-A78 at 2.85GHz | LPDDR5 (up to 400 Mbps) | UFS 3.1 | MC6 Mali-G610 | WQHD+@120Hz, FHD++@180Hz(stills) | 200 MP | 4.7 GHz uplink | Wi-Fi 6E (2×2) | 5.3 |
The 8300 Dimensity is equipped with a Finger Mali-G615 MC6 GPU, offering a significant 60% performance boost and 55% enhanced energy efficiency at peak performance levels compared to its predecessor. MediaTek claims that app cold launches can be up to 17% faster with this new chipset than game launches from standby mode. It also supports UFS 4.0 storage with Multi-Circular Lane (MCQ) technology and Quad-channel LPDDR5X RAM running at frequencies of 8,533Mbps.
The inclusion of the APU 780 in the 8300 Dimensity marks it as the first chip in its category to support Generative AI, providing stable diffusion and accommodating up to 10 billion parameters for Large Language Models (LLM). The Imagiq 980 Image Signal Processor (ISP) supports camera sensors up to 320MP and enables 4K video recording at 60fps.
Breakdown of MediaTek 8300 Dimensity:
The 8300 Dimensity integrates a 5G modem supporting dual-mode 5G with speeds of up to 5.17Gbps on sub-6GHz networks. It also features Wi-Fi 6E and Bluetooth 5.4 connectivity options.
Xiaomi has already confirmed that the Redmi K70E will be the first device to debut with the MediaTek 8300 Dimensity later this month.
Source: [Original Source]
